1. Overview of Equipment and Application Fields

The PT13M-BE plasma cleaner is a compact low-temperature plasma surface treatment system specifically designed for research institutes, university laboratories, and R&D centers. Utilizing advanced 13.56MHz radio frequency (RF) excitation technology, this equipment generates a low-energy yet high-density plasma field in a vacuum environment. The unique properties of this low-temperature plasma make it particularly suitable for processing heat-sensitive materials such as polymer composites, biological tissues, and flexible electronic substrates. It achieves ultra-precision cleaning, surface activation, micro-etching, and hydrophilic/hydrophobic modification while ensuring thermal damage-free substrate integrity.

The PT13M-BE eliminates the chemical reagent consumption and waste liquid discharge issues associated with traditional wet cleaning methods, offering an eco-friendly, non-polluting dry cleaning solution. Its one-touch operation design significantly simplifies the experimental process, enabling even non-professionals to quickly get started. The compact aluminum alloy housing (6.4L capacity) not only saves laboratory space but also meets the processing requirements for various substrates under 8 inches (200mm×200mm). Whether handling complex irregular shapes or precision optical components, it ensures uniform and consistent processing results.

Widespread application areas:

· Semiconductors and Microelectronics: Pre-packaging processes including 8-inch wafer cleaning, lead frame activation, and PCB pad oxidation removal.

· Biomedical applications: Surface hydrophilic modification of cell culture dishes, microfluidic chips, and stent grafts to enhance cell adhesion rate and biocompatibility.

· Development of novel materials: Surface cleaning and functional group introduction of nanomaterials, graphene, and carbon fiber composites.

· Optics and Display: Lens modules and pre-coating cleaning of OLED/LCD substrates to remove fingerprints, oils, and particles, thereby enhancing film adhesion.

· Polymer materials: Pre-treatment of adhesion, printing and coating for plastics, rubber, ceramics and other materials to solve the problem of adhesion.

2. Core Functional Highlights

13.56MHz High Frequency RF Power Supply System

o High-frequency excitation: Using a standard 13.56MHz RF power supply, it generates a denser and more uniform plasma than low-frequency power, significantly improving cleaning efficiency and surface modification depth.

o Wide-range power adjustment: The output power can be continuously and steplessly adjusted within the range of 0-200W, with a maximum peak power of up to 300W. Users can precisely control the plasma intensity according to material tolerance and process requirements, enabling flexible switching from mild activation to intense etching.

o Automatic matching network: Equipped with an integrated auto-matcher that continuously monitors load variations and dynamically adjusts impedance matching. This ensures optimal RF energy transmission to the cavity, maintains long-term plasma stability, and enhances process reproducibility.

Low temperature high density plasma technology

o Low-temperature protection: The unique discharge design maintains the plasma in a 'cold' state (near room temperature), effectively preventing deformation or denaturation of heat-sensitive materials (e.g., PET, PI, biological proteins) caused by high temperatures.

o High-density active particles: These generate high-density high-energy ions, electrons, and free radicals, which rapidly penetrate the microscopic pores of material surfaces to thoroughly remove nanoscale organic contaminants (such as oils, photoresists, and fluxes). They also introduce abundant polar groups (-OH, -COOH, etc.), significantly enhancing surface energy.

o Complex shape adaptability: The gas permeability of plasma enables it to process workpieces with complex shapes, deep holes, or blind grooves without dead zones, an advantage that traditional wet cleaning methods cannot match.

Compact and Efficient Vacuum and Airflow System

o Rapid vacuum extraction: Featuring a high-performance mechanical vacuum pump with a standard pumping speed of 4m³/h and an optimized cavity flow design, it rapidly reduces the cabin pressure to a working vacuum level of **<10Pa**, significantly shortening experimental preparation time.

o Precision airflow control: Featuring a single-channel float flowmeter, it provides real-time visual display and manual adjustment of process gas flow (e.g., O₂, Ar, H₂, Air), ensuring simple and reliable operation.

o Rapid and stable: The system has optimized the gas response speed, with the gas stabilization time reduced to just 40 seconds, enabling immediate entry into a stable plasma reaction state, significantly enhancing experimental efficiency.

Humanized Design and Intelligent Control

o One-click operation: The control panel features a simple and intuitive design, integrating functions such as vacuum, air intake, ignition, and timing. Users only need to set the processing time (up to 999 seconds) to initiate the fully automated workflow with a single click, requiring no complex professional training.

o Lightweight aluminum alloy housing: The cabin is constructed from premium aluminum alloy, measuring 226mm×126mm×224mm. Its robust yet lightweight design offers excellent corrosion resistance, ensuring easy handling and maintenance.

o Visual observation window: The chamber is equipped with a transparent observation window, enabling users to monitor the color and state of the plasma glow in real time and visually assess the reaction progress.

o Safety interlock protection: Equipped with access control safety switches and overcurrent/overheat protection mechanisms, it automatically cuts off high-voltage power in abnormal conditions to ensure the safety of personnel and equipment.

3. Technical Parameters and Specifications

4. Detailed Explanation of Typical Application Scenarios

Research in Semiconductor and Microelectronics:

o Wafer photoresist removal: Eliminates residual photoresist from silicon wafers under 8 inches after photolithography, leaving no chemical solvent traces and ensuring seamless integration with subsequent processes.

o Pre-bonding treatment: Activates lead frame or chip pad surfaces, removes trace oxide layers and organic residues, significantly enhances gold/copper wire bonding strength, and reduces false soldering rates.

Biomedical Engineering Research:

o Cell culture modification: Hydrophobic culture dishes such as polystyrene (PS) and polydimethylsiloxane (PDMS) were treated with oxygen plasma to introduce hydrophilic groups, significantly reducing the contact angle and promoting rapid cell adhesion and growth.

o Microfluidic chip cleaning: Remove processing residues and dust from microchannels to improve fluid wettability and ensure the accuracy of microfluidic experiments.

New Materials and Nanotechnology:

o Pre-treatment of nanomaterials dispersion: Clean the surface of carbon nanotubes and graphene powder, remove the organic impurities on the surface, and improve their dispersibility and reactivity in the solvent.

o The interface modification of composite materials: Surface etching and activation of carbon fiber and glass fiber to enhance the bonding force between the carbon fiber and the resin matrix, and improve the mechanical properties of composite materials.

Optics and Precision Instruments:

o Pre-coating lens cleaning: Thoroughly remove fingerprints, grease, and particles from the lens and prism surfaces before coating to prevent pitting and delamination of the film layer, thereby enhancing optical transmittance and durability.

o Sensor encapsulation: Clean the MEMS sensor surface to remove flux residues from the encapsulation process, ensuring sensor sensitivity and long-term stability.

Polymer Material Processing Experiment:

o Enhanced printability: Surface treatment of challenging-to-print films (PE, PP, PTFE) improves ink adhesion and resolves ink bleeding issues.

o Enhanced adhesion: Activated rubber seals and plastic casing surfaces significantly improve adhesive strength, replacing traditional primer application processes with an eco-friendly and efficient solution.

5. Why choose the PT13M-BE plasma cleaner?

The PT13M-BE plasma cleaner, leveraging its 13.56MHz high-frequency radio frequency technology and low-temperature high-density plasma characteristics, has become an expert in processing special materials and complex-shaped workpieces. With its wide power adjustment range of 0-200W (peak 300W) and automatic matching function, it ensures process flexibility and stability, meeting diverse needs from mild activation to intensive cleaning. The low working vacuum of <10Pa and rapid gas stabilization time of 40 seconds significantly enhance experimental efficiency. The compact aluminum alloy chamber design not only saves space but also provides excellent corrosion resistance. One-touch operation simplifies complex plasma processes, making it ideal for research institutions and small-to-medium laboratories. As a chemical-free, waste-free green cleaning technology, the PT13M-BE fully complies with modern laboratory environmental standards. Choosing the PT13M-BE means selecting an efficient, precise, and eco-friendly surface treatment solution, helping you achieve breakthrough progress in micro-surface modification and accelerate the translation of scientific research results.